GlobalFoundries to make key AI chip component for TSMC
The five-year deal expands Malta capacity and gives TSMC a U.S. source for interposers used in advanced AI chip packaging.
- On Thursday, October 08, 2026, GlobalFoundries announced a five-year agreement with TSMC to produce silicon interposers at its Malta, New York, facility, establishing the first U.S.-based source for these advanced packaging components.
- Advanced packaging has become a major constraint on AI chip production, as demand for the technology exceeds available manufacturing capacity, prompting this domestic partnership.
- Silicon interposers sit beneath processors and memory chips to enable high-speed communication between components. "By providing manufacturing service using GF," said Ed Kaste, senior vice president of CMOS Business at GF, the company creates a secure source.
- Volume production is expected to begin ramping up in the first half of 2028, reducing current reliance on round-tripping products like Nvidia's Blackwell generation of GPUs to Taiwan for final assembly.
- The agreement provides a framework for future capacity expansion, though success remains subject to geopolitical risks and potential delays in expected funding under U.S. CHIPS initiatives.
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TSMC, the world's largest semiconductor foundry based in Taiwan, is sourcing key components necessary for the production of artificial intelligence (AI) semiconductors locally in the United States. By establishing an advanced packaging supply chain in addition to domestic semiconductor production, the company is accelerating the localization of its AI semiconductor manufacturing processes. According to industry sources on the 12th, U.S. foundry …
TSMC Turns to GlobalFoundries for $2 Billion U.S. Boost in Critical AI Packaging Component
GlobalFoundries will manufacture silicon interposers for TSMC's CoWoS platform in New York under a $2B deal, creating the first U.S. source of this critical AI packaging component. Volume production begins in 2028, addressing severe capacity constraints that currently limit advanced chip output. The agreement advances domestic supply-chain goals while highlighting ongoing bottlenecks.
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