Huawei: "Test Results for Chips Launching Next Year Meet expectations... Progress Continues"

Huawei’s LogicFolding Architecture Has Surpassed Expectations, As Early 2027 Kirin Results Meet Company’s Targets Without Reliance On Advanced Nodes

The lack of access to specialized EUV machinery meant that there was no way for Huawei to compete in the traditional manner of taking advantage of next-generation manufacturing processes, so it relied on “out of the box” methods, such as moving to improved packaging technologies. Its LogicFolding architecture, which was announced in May of this year, has reportedly surpassed expectations, as early test results of a 2027 Kirin SoC have met the Ch…