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The iPhone Duo’s Cooling System Hides a Clever Trick Inside Its Hinge

Apple says the flexible graphite pipe helps dissipate heat from the A20 Pro while preserving hinge durability across many cycles.

  • Apple routed a flexible graphite pipe through the Duo hinge to transfer heat between the two halves, increasing the surface area available for heat dissipation.
  • The A20 Pro utilizes a 2nm process and unstacks the DRAM module, placing it next to the chip in a WMCM configuration to facilitate quicker data speeds and more effective heat management.
  • Banafsheh Barabadi, Apple's senior manager of thermal product design, said the "metal over foam" material creates a direct thermal coupling between the SoC and the vapor chamber, eliminating the thermal bottleneck of previous POP packaging.
  • For the Duo, Apple added a second display engine to support simultaneous operation of the inner and outer displays, ensuring smooth performance with increased CPU and GPU capabilities.
  • When released on October 23, the Duo promises capabilities similar to the Pro Max, which earned a PCMag Lab Award for record-setting battery longevity.
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The iPhone Duo hides secrets in its hinge, an interview with executives reveals these details

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PC Mag broke the news in New York, United States on Monday, October 12, 2026.
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